Q: You have often written about the legal problems arising in the course of the host-IC relationship. If our agency were to design a hosting program and IC contract from scratch, what terms and ...

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...

Credence Systems has introduced the GlobalScan-I, an IC diagnostic system that performs physical device analysis to pinpoint process performance yield problems. The company claims that GlobalScan-I ...

ANAHEIM, Calif. — At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...