Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...

Most system administrators who have been packaging software will have realized that 10 commandments are not enough to cover software packaging. That’s why we bring you 10 more commandments. Along with ...

EASI-Studio 3.0, part of the EASI-Tools family, offers designers automated solutions for packaging and deploying IP in a repeatable and reliable manner. EASI-Studio 3.0 provides the ability to capture ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...